Yongping Lei

168 papers and 3.6k indexed citations i.

Yongping Lei has authored 168 papers that have received a total of 3.6k indexed citations. This includes 147 papers in Mechanical Engineering, 56 papers in Electrical and Electronic Engineering and 53 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (50 papers), Metal Alloys Wear and Properties (38 papers) and Advanced materials and composites (35 papers). Yongping Lei is often cited by papers focused on Electronic Packaging and Soldering Technologies (50 papers), Metal Alloys Wear and Properties (38 papers) and Advanced materials and composites (35 papers) and collaborates with scholars based in China, Japan and Ireland. Yongping Lei's co-authors include Hanguang Fu, Yao Shi, Jian Lin, Zhidong Xia and Fu Guo and has published in prestigious journals such as Materials Science and Engineering A, Journal of Materials Science and Applied Surface Science.