Yoonchul Sohn
About
Yoonchul Sohn has authored 31 papers that have received a total of 454 indexed citations.
This includes 23 papers in Electrical and Electronic Engineering, 15 papers in Mechanical Engineering and 8 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (13 papers) and Carbon Nanotubes in Composites (6 papers). Yoonchul Sohn is often cited by papers focused on Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (13 papers) and Carbon Nanotubes in Composites (6 papers) and collaborates with scholars based in South Korea and United States. Yoonchul Sohn's co-authors include Jin Yu, Kunmo Chu, Sung Hoon Park, Sang-Eui Lee and Chang-Lae Kim and has published in prestigious journals such as Applied Physics Letters, Applied Surface Science and Scripta Materialia
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