Young‐Ho Kim
About
Young‐Ho Kim has authored 130 papers that have received a total of 1.4k indexed citations.
This includes 95 papers in Electrical and Electronic Engineering, 31 papers in Polymers and Plastics and 28 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (49 papers), 3D IC and TSV technologies (43 papers) and Synthesis and properties of polymers (18 papers). Young‐Ho Kim is often cited by papers focused on Electronic Packaging and Soldering Technologies (49 papers), 3D IC and TSV technologies (43 papers) and Synthesis and properties of polymers (18 papers) and collaborates with scholars based in South Korea, United States and Australia. Young‐Ho Kim's co-authors include Young‐Min Kim, Eun Kyu Kim, Chong Seung Yoon, Sehoon Yoo and Dong Uk Lee and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Advanced Functional Materials
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