Yu-Jung Huang
About
Yu-Jung Huang has authored 24 papers that have received a total of 186 indexed citations.
This includes 15 papers in Electrical and Electronic Engineering, 6 papers in Media Technology and 5 papers in Biomedical Engineering. The topics of these papers are 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (5 papers) and VLSI and FPGA Design Techniques (4 papers). Yu-Jung Huang is often cited by papers focused on 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (5 papers) and VLSI and FPGA Design Techniques (4 papers) and collaborates with scholars based in Taiwan and United States. Yu-Jung Huang's co-authors include Shen‐Li Fu, Wei‐Cheng Lin, Shao‐I Chu, Trieu‐Kien Truong and Yuan‐Yang Cheng and has published in prestigious journals such as IEEE Transactions on Industrial Electronics, IEEE Transactions on Signal Processing and Sensors
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