Yu‐Jung Huang
About
Yu‐Jung Huang has authored 24 papers that have received a total of 188 indexed citations.
This includes 15 papers in Electrical and Electronic Engineering, 6 papers in Media Technology and 4 papers in Biomedical Engineering. The topics of these papers are 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (5 papers) and VLSI and FPGA Design Techniques (4 papers). Yu‐Jung Huang is often cited by papers focused on 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (5 papers) and VLSI and FPGA Design Techniques (4 papers) and collaborates with scholars based in Taiwan and United States. Yu‐Jung Huang's co-authors include Shen‐Li Fu, Wei‐Cheng Lin, Trieu‐Kien Truong, Shao‐I Chu and Wei‐Chen Lin and has published in prestigious journals such as IEEE Transactions on Industrial Electronics, IEEE Transactions on Signal Processing and Sensors.
In The Last Decade
Fields of papers published by Yu‐Jung Huang
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries citing papers authored by Yu‐Jung Huang
Since SpecializationCitations
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