Yunhui Mei
About
Yunhui Mei has authored 126 papers that have received a total of 1.9k indexed citations.
This includes 113 papers in Electrical and Electronic Engineering, 51 papers in Mechanical Engineering and 21 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (71 papers), 3D IC and TSV technologies (41 papers) and Silicon Carbide Semiconductor Technologies (33 papers). Yunhui Mei is often cited by papers focused on Electronic Packaging and Soldering Technologies (71 papers), 3D IC and TSV technologies (41 papers) and Silicon Carbide Semiconductor Technologies (33 papers) and collaborates with scholars based in China, United States and Malaysia. Yunhui Mei's co-authors include Guo‐Quan Lu, Xu Chen and Gang Chen and has published in prestigious journals such as Materials Science and Engineering A, IEEE Transactions on Power Electronics and Applied Surface Science
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