Yunpeng Wang
About
Yunpeng Wang has authored 157 papers that have received a total of 2.2k indexed citations.
This includes 95 papers in Electrical and Electronic Engineering, 70 papers in Materials Chemistry and 37 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (42 papers), 3D IC and TSV technologies (25 papers) and Aluminum Alloys Composites Properties (16 papers). Yunpeng Wang is often cited by papers focused on Electronic Packaging and Soldering Technologies (42 papers), 3D IC and TSV technologies (25 papers) and Aluminum Alloys Composites Properties (16 papers) and collaborates with scholars based in China, United States and Japan. Yunpeng Wang's co-authors include Haitao Ma, Anil Kunwar, Ning Zhao, Chong Dong and Haoran Ma and has published in prestigious journals such as Nature, Nature Communications and Nano Letters
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