Yunpeng Wang

164 papers and 2.3k indexed citations i.

Yunpeng Wang has authored 164 papers that have received a total of 2.3k indexed citations. This includes 98 papers in Electrical and Electronic Engineering, 72 papers in Materials Chemistry and 38 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (44 papers), 3D IC and TSV technologies (25 papers) and Aluminum Alloys Composites Properties (16 papers). Yunpeng Wang is often cited by papers focused on Electronic Packaging and Soldering Technologies (44 papers), 3D IC and TSV technologies (25 papers) and Aluminum Alloys Composites Properties (16 papers) and collaborates with scholars based in China, United States and Japan. Yunpeng Wang's co-authors include Haitao Ma, Anil Kunwar, Ning Zhao, Haoran Ma and Jun Chen and has published in prestigious journals such as Nature, Nature Communications and Nano Letters.