Z. Feng
About
Z. Feng has authored 14 papers that have received a total of 188 indexed citations.
This includes 11 papers in Electrical and Electronic Engineering, 7 papers in Mechanics of Materials and 3 papers in Materials Chemistry. The topics of these papers are Metal and Thin Film Mechanics (6 papers), Advancements in Photolithography Techniques (6 papers) and Electronic Packaging and Soldering Technologies (4 papers). Z. Feng is often cited by papers focused on Metal and Thin Film Mechanics (6 papers), Advancements in Photolithography Techniques (6 papers) and Electronic Packaging and Soldering Technologies (4 papers) and collaborates with scholars based in United States and Japan. Z. Feng's co-authors include Roxann L. Engelstad, Edward G. Lovell, T. F. Kuech, D.W. Burns and Hideaki Yamada and has published in prestigious journals such as Applied Physics Letters, Sensors and Actuators A Physical and Diamond and Related Materials
In The Last Decade
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