Zao Liu
About
Zao Liu has authored 32 papers that have received a total of 466 indexed citations.
This includes 11 papers in Electrical and Electronic Engineering, 5 papers in Molecular Biology and 3 papers in Information Systems. The topics of these papers are Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (3 papers) and Low-power high-performance VLSI design (3 papers). Zao Liu is often cited by papers focused on Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (3 papers) and Low-power high-performance VLSI design (3 papers) and collaborates with scholars based in United States and China. Zao Liu's co-authors include Sheldon X.-D. Tan, Ashish Gupta, Hai Wang, Jiwen Feng and Hai Wang and has published in prestigious journals such as PLoS ONE, Scientific Reports and BMC Bioinformatics
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