Zhi‐Quan Liu
About
Zhi‐Quan Liu has authored 195 papers that have received a total of 6.0k indexed citations.
This includes 116 papers in Electrical and Electronic Engineering, 82 papers in Mechanical Engineering and 51 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (79 papers), 3D IC and TSV technologies (47 papers) and Intermetallics and Advanced Alloy Properties (28 papers). Zhi‐Quan Liu is often cited by papers focused on Electronic Packaging and Soldering Technologies (79 papers), 3D IC and TSV technologies (47 papers) and Intermetallics and Advanced Alloy Properties (28 papers) and collaborates with scholars based in China, Japan and United States. Zhi‐Quan Liu's co-authors include Caifu Li, Panju Shang, Kazuo Furuya, Kazutaka Mitsuishi and Li‐Yin Gao and has published in prestigious journals such as Nature, Science and Physical Review Letters
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