Zhong Sheng
About
Zhong Sheng has authored 14 papers that have received a total of 499 indexed citations.
This includes 14 papers in Mechanical Engineering, 13 papers in Electrical and Electronic Engineering and 2 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (13 papers), Intermetallics and Advanced Alloy Properties (7 papers) and 3D IC and TSV technologies (6 papers). Zhong Sheng is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), Intermetallics and Advanced Alloy Properties (7 papers) and 3D IC and TSV technologies (6 papers) and collaborates with scholars based in China. Zhong Sheng's co-authors include Lili Gao, Songbai Xue, YU Sheng-lin, Yan Chen and Guang Zeng and has published in prestigious journals such as Microelectronic Engineering, Modelling and Simulation in Materials Science and Engineering and Microelectronics Reliability
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