Ziren Wang
About
Ziren Wang has authored 44 papers that have received a total of 509 indexed citations.
This includes 19 papers in Electrical and Electronic Engineering, 9 papers in Molecular Biology and 8 papers in Mechanical Engineering. The topics of these papers are Electromagnetic Compatibility and Noise Suppression (14 papers), Electronic Packaging and Soldering Technologies (12 papers) and 3D IC and TSV technologies (8 papers). Ziren Wang is often cited by papers focused on Electromagnetic Compatibility and Noise Suppression (14 papers), Electronic Packaging and Soldering Technologies (12 papers) and 3D IC and TSV technologies (8 papers) and collaborates with scholars based in China, United States and Japan. Ziren Wang's co-authors include Jinchun Gao, Wei Yi, George T. Flowers, Huanbo Wang and Z.‐Y. Cheng and has published in prestigious journals such as The Journal of Comparative Neurology, Construction and Building Materials and Fuel
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