Zonghe Lai
About
Zonghe Lai has authored 22 papers that have received a total of 452 indexed citations.
This includes 17 papers in Electrical and Electronic Engineering, 7 papers in Biomedical Engineering and 7 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (7 papers) and Semiconductor Quantum Structures and Devices (5 papers). Zonghe Lai is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (7 papers) and Semiconductor Quantum Structures and Devices (5 papers) and collaborates with scholars based in Sweden, China and Norway. Zonghe Lai's co-authors include Johan Liu, Yuxin Song, Shumin Wang, Xitao Wang and Shiming Li and has published in prestigious journals such as Advanced Materials, Applied Physics Letters and Journal of Applied Physics
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