IEEE Transactions on Components and Packaging Technologies
About
The 1.2k papers published in IEEE Transactions on Components and Packaging Technologies in the last decades have received a total of 23.6k indexed citations.
Papers published in IEEE Transactions on Components and Packaging Technologies usually cover Electrical and Electronic Engineering (775 papers), Mechanical Engineering (515 papers) and Mechanics of Materials (241 papers) specifically the topics of Electronic Packaging and Soldering Technologies (471 papers), 3D IC and TSV technologies (288 papers) and Heat Transfer and Optimization (199 papers). The most active scholars publishing in IEEE Transactions on Components and Packaging Technologies are Michael Pecht, C.P. Wong, Avram Bar‐Cohen, Yogendra Joshi and Suresh V. Garimella.
In The Last Decade
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Countries where authors publish in IEEE Transactions on Components and Packaging Technologies
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