IEEE Transactions on Components Packaging and Manufacturing Technology Part B
About
The 385 papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part B in the last decades have received a total of 4.6k indexed citations.
Papers published in IEEE Transactions on Components Packaging and Manufacturing Technology Part B usually cover Electrical and Electronic Engineering (356 papers), Mechanical Engineering (47 papers) and Mechanics of Materials (43 papers) specifically the topics of Electronic Packaging and Soldering Technologies (150 papers), 3D IC and TSV technologies (139 papers) and Electromagnetic Compatibility and Noise Suppression (105 papers). The most active scholars publishing in IEEE Transactions on Components Packaging and Manufacturing Technology Part B are J.K.L. Lai, J.L. Prince, Madhavan Swaminathan, Y.C. Chan and G. Katopis.
In The Last Decade
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