A. Ostmann

49 papers and 375 indexed citations i.

A. Ostmann has authored 49 papers that have received a total of 375 indexed citations. This includes 43 papers in Electrical and Electronic Engineering, 12 papers in Automotive Engineering and 7 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are 3D IC and TSV technologies (33 papers), Electronic Packaging and Soldering Technologies (28 papers) and Additive Manufacturing and 3D Printing Technologies (11 papers). A. Ostmann is often cited by papers focused on 3D IC and TSV technologies (33 papers), Electronic Packaging and Soldering Technologies (28 papers) and Additive Manufacturing and 3D Printing Technologies (11 papers) and collaborates with scholars based in Germany, China and Greece. A. Ostmann's co-authors include H. Reichl, R. Aschenbrenner, D. Manessis, Martin Schneider‐Ramelow and K.-D. Lang and has published in prestigious journals such as Applied Physics Letters, Solar Energy Materials and Solar Cells and Physical review. B, Condensed matter