R. Aschenbrenner

43 papers and 301 indexed citations i.

R. Aschenbrenner has authored 43 papers that have received a total of 301 indexed citations. This includes 36 papers in Electrical and Electronic Engineering, 11 papers in Automotive Engineering and 4 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (27 papers), 3D IC and TSV technologies (27 papers) and Additive Manufacturing and 3D Printing Technologies (11 papers). R. Aschenbrenner is often cited by papers focused on Electronic Packaging and Soldering Technologies (27 papers), 3D IC and TSV technologies (27 papers) and Additive Manufacturing and 3D Printing Technologies (11 papers) and collaborates with scholars based in Germany, Cyprus and Greece. R. Aschenbrenner's co-authors include H. Reichl, A. Ostmann, Tanja Braun, V. Bader and Matthias Koch and has published in prestigious journals such as Microelectronics Reliability, physica status solidi (a) and Microsystem Technologies