A. Syed

5 papers and 39 indexed citations i.

A. Syed has authored 5 papers that have received a total of 39 indexed citations. This includes 3 papers in Electrical and Electronic Engineering, 2 papers in Civil and Structural Engineering and 2 papers in Building and Construction. The topics of these papers are Electronic Packaging and Soldering Technologies (3 papers), 3D IC and TSV technologies (3 papers) and Concrete Corrosion and Durability (2 papers). A. Syed is often cited by papers focused on Electronic Packaging and Soldering Technologies (3 papers), 3D IC and TSV technologies (3 papers) and Concrete Corrosion and Durability (2 papers) and collaborates with scholars based in Germany. A. Syed's co-authors include Seung Mo Kim, Jin‐Young Kim, Wei Lin and Jesse Galloway and has published in prestigious journals such as Engineering Structures, IEEE Transactions on Components and Packaging Technologies and IEEE Transactions on Electronics Packaging Manufacturing