IEEE Transactions on Electronics Packaging Manufacturing
About
The 449 papers published in IEEE Transactions on Electronics Packaging Manufacturing in the last decades have received a total of 8.0k indexed citations.
Papers published in IEEE Transactions on Electronics Packaging Manufacturing usually cover Electrical and Electronic Engineering (325 papers), Mechanical Engineering (120 papers) and Industrial and Manufacturing Engineering (84 papers) specifically the topics of Electronic Packaging and Soldering Technologies (230 papers), 3D IC and TSV technologies (154 papers) and Manufacturing Process and Optimization (47 papers). The most active scholars publishing in IEEE Transactions on Electronics Packaging Manufacturing are Wayne Johnson, Michael Pecht, Kyung‐Wook Paik, C.P. Wong and Peng Su.
In The Last Decade
Fields of papers published in IEEE Transactions on Electronics Packaging Manufacturing
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries where authors publish in IEEE Transactions on Electronics Packaging Manufacturing
Since SpecializationTotal citations of papers
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