IEEE Transactions on Electronics Packaging Manufacturing
About
The 449 papers published in IEEE Transactions on Electronics Packaging Manufacturing in the last decades have received a total of 8.0k indexed citations.
Papers published in IEEE Transactions on Electronics Packaging Manufacturing usually cover Electrical and Electronic Engineering (325 papers), Mechanical Engineering (120 papers) and Industrial and Manufacturing Engineering (84 papers) specifically the topics of Electronic Packaging and Soldering Technologies (230 papers), 3D IC and TSV technologies (154 papers) and Manufacturing Process and Optimization (47 papers). The most active scholars publishing in IEEE Transactions on Electronics Packaging Manufacturing are Wayne Johnson, Michael Pecht, Kyung‐Wook Paik, C.P. Wong and Daniel Chen.
In The Last Decade
Fields of papers published in IEEE Transactions on Electronics Packaging Manufacturing
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
This network shows the specialization of papers published in IEEE Transactions on Electronics Packaging Manufacturing. Nodes represent fields, and links connect fields that are likely to share authors.
Countries where authors publish in IEEE Transactions on Electronics Packaging Manufacturing
Since SpecializationTotal citations of papers
This map shows the geographic distribution of research published in IEEE Transactions on Electronics Packaging Manufacturing. It shows the number of citations received by papers published by authors working in each country. You can also color the map by specialization and compare the number of papers published in IEEE Transactions on Electronics Packaging Manufacturing with the expected number of papers based on a country's size and research output (numbers larger than one mean the country's share of papers is larger than expected).
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