Wayne Johnson
About
Wayne Johnson has authored 211 papers that have received a total of 4.8k indexed citations.
This includes 113 papers in Electrical and Electronic Engineering, 48 papers in Aerospace Engineering and 44 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (59 papers), 3D IC and TSV technologies (42 papers) and Silicon Carbide Semiconductor Technologies (34 papers). Wayne Johnson is often cited by papers focused on Electronic Packaging and Soldering Technologies (59 papers), 3D IC and TSV technologies (42 papers) and Silicon Carbide Semiconductor Technologies (34 papers) and collaborates with scholars based in United States, United Kingdom and Sweden. Wayne Johnson's co-authors include Michael C. Hamilton, R.C. Jaeger, Jeff B. Casady, Fang Yu and Jeffrey C. Suhling and has published in prestigious journals such as Nature, Applied Physics Letters and Journal of Applied Physics
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