Jeffrey C. Suhling
About
Jeffrey C. Suhling has authored 58 papers that have received a total of 1.4k indexed citations.
This includes 50 papers in Electrical and Electronic Engineering, 16 papers in Mechanical Engineering and 11 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (29 papers), Advanced MEMS and NEMS Technologies (22 papers) and 3D IC and TSV technologies (16 papers). Jeffrey C. Suhling is often cited by papers focused on Electronic Packaging and Soldering Technologies (29 papers), Advanced MEMS and NEMS Technologies (22 papers) and 3D IC and TSV technologies (16 papers) and collaborates with scholars based in United States, Bangladesh and South Korea. Jeffrey C. Suhling's co-authors include R.C. Jaeger, Pradeep Lall, Michael J. Bozack, Wayne Johnson and John L. Evans and has published in prestigious journals such as Journal of Materials Science, IEEE Transactions on Electron Devices and Japanese Journal of Applied Physics
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