Pradeep Lall
About
Pradeep Lall has authored 101 papers that have received a total of 821 indexed citations.
This includes 91 papers in Electrical and Electronic Engineering, 17 papers in Mechanical Engineering and 13 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (65 papers), Integrated Circuits and Semiconductor Failure Analysis (27 papers) and 3D IC and TSV technologies (25 papers). Pradeep Lall is often cited by papers focused on Electronic Packaging and Soldering Technologies (65 papers), Integrated Circuits and Semiconductor Failure Analysis (27 papers) and 3D IC and TSV technologies (25 papers) and collaborates with scholars based in United States, Israel and Germany. Pradeep Lall's co-authors include Jeff Suhling, Dhananjay Panchagade, Jeffrey C. Suhling, Kai Goebel and Junchao Wei and has published in prestigious journals such as IEEE Transactions on Industrial Electronics, IEEE Access and Journal of Vacuum Science & Technology A Vacuum Surfaces and Films
In The Last Decade
Explore authors with similar magnitude of impact
Top journals papers by Jianxun Wang are published in Top fields papers by Keith E. Whittington are about Top fields papers by Sebastiaan Meijer are about Top countries impacted by papers by Evanilde Benedito Top journals papers by Riccardo E. Zich are published in Top countries impacted by papers by Ying Xue Top countries impacted by papers by Cheol-Hong Hwang Top fields papers by Miguel Dall’Agnol are about