Michael J. Bozack
About
Michael J. Bozack has authored 91 papers that have received a total of 2.1k indexed citations.
This includes 54 papers in Electrical and Electronic Engineering, 24 papers in Materials Chemistry and 22 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (20 papers), Semiconductor materials and devices (14 papers) and 3D IC and TSV technologies (13 papers). Michael J. Bozack is often cited by papers focused on Electronic Packaging and Soldering Technologies (20 papers), Semiconductor materials and devices (14 papers) and 3D IC and TSV technologies (13 papers) and collaborates with scholars based in United States, China and Singapore. Michael J. Bozack's co-authors include John R. Williams, W. J. Choyke, John L. Evans, Minseo Park and Jeffrey C. Suhling and has published in prestigious journals such as Journal of the American Chemical Society, The Journal of Chemical Physics and Applied Physics Letters
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