John L. Evans

39 papers and 825 indexed citations i.

John L. Evans has authored 39 papers that have received a total of 825 indexed citations. This includes 21 papers in Electrical and Electronic Engineering, 8 papers in Aerospace Engineering and 6 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (16 papers) and Aluminum Alloy Microstructure Properties (6 papers). John L. Evans is often cited by papers focused on Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (16 papers) and Aluminum Alloy Microstructure Properties (6 papers) and collaborates with scholars based in United States, United Kingdom and South Korea. John L. Evans's co-authors include Michael J. Bozack, Jiawei Zhang, Jeffrey C. Suhling, Pradeep Lall and Wayne Johnson and has published in prestigious journals such as The Journal of Finance, The Analyst and Materials