Kyung‐Wook Paik
About
Kyung‐Wook Paik has authored 169 papers that have received a total of 3.2k indexed citations.
This includes 136 papers in Electrical and Electronic Engineering, 54 papers in Biomedical Engineering and 42 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (127 papers), 3D IC and TSV technologies (101 papers) and Advanced Sensor and Energy Harvesting Materials (41 papers). Kyung‐Wook Paik is often cited by papers focused on Electronic Packaging and Soldering Technologies (127 papers), 3D IC and TSV technologies (101 papers) and Advanced Sensor and Energy Harvesting Materials (41 papers) and collaborates with scholars based in South Korea, China and Germany. Kyung‐Wook Paik's co-authors include Shuye Zhang, Peng He, Woon‐Seong Kwon, Tiesong Lin and Soon-Bok Lee and has published in prestigious journals such as Advanced Materials, Journal of Applied Physics and Journal of The Electrochemical Society
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