Soon-Bok Lee
About
Soon-Bok Lee has authored 82 papers that have received a total of 1.6k indexed citations.
This includes 42 papers in Mechanics of Materials, 40 papers in Mechanical Engineering and 36 papers in Electrical and Electronic Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (29 papers), Fatigue and fracture mechanics (20 papers) and 3D IC and TSV technologies (19 papers). Soon-Bok Lee is often cited by papers focused on Electronic Packaging and Soldering Technologies (29 papers), Fatigue and fracture mechanics (20 papers) and 3D IC and TSV technologies (19 papers) and collaborates with scholars based in South Korea, United States and Singapore. Soon-Bok Lee's co-authors include Gi‐Dong Sim, Kyung‐Wook Paik, Sejeong Won, Il‐Ho Kim and Hak‐Joo Lee and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Acta Materialia
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