Woon‐Seong Kwon
About
Woon‐Seong Kwon has authored 13 papers that have received a total of 230 indexed citations.
This includes 13 papers in Electrical and Electronic Engineering, 3 papers in Mechanics of Materials and 2 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (13 papers) and Electromagnetic Compatibility and Noise Suppression (2 papers). Woon‐Seong Kwon is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (13 papers) and Electromagnetic Compatibility and Noise Suppression (2 papers) and collaborates with scholars based in South Korea, United States and Singapore. Woon‐Seong Kwon's co-authors include Kyung‐Wook Paik, Soon-Bok Lee, Myung Jin Yim, Jin-Sang Hwang and Myung-Jin Yim and has published in prestigious journals such as Journal of Applied Polymer Science, Materials Science and Engineering B and International Journal of Adhesion and Adhesives
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