Myung Jin Yim

27 papers and 584 indexed citations i.

Myung Jin Yim has authored 27 papers that have received a total of 584 indexed citations. This includes 27 papers in Electrical and Electronic Engineering, 5 papers in Mechanical Engineering and 4 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (25 papers), 3D IC and TSV technologies (19 papers) and Molecular Junctions and Nanostructures (4 papers). Myung Jin Yim is often cited by papers focused on Electronic Packaging and Soldering Technologies (25 papers), 3D IC and TSV technologies (19 papers) and Molecular Junctions and Nanostructures (4 papers) and collaborates with scholars based in United States and South Korea. Myung Jin Yim's co-authors include Kyung Wook Paik, C.P. Wong, Kyoung‐Sik Moon, Yi Li and Kyung‐Wook Paik and has published in prestigious journals such as Applied Physics Letters, Materials Science and Engineering B and International Journal of Adhesion and Adhesives