Kyung Wook Paik

44 papers and 857 indexed citations i.

Kyung Wook Paik has authored 44 papers that have received a total of 857 indexed citations. This includes 28 papers in Electrical and Electronic Engineering, 14 papers in Mechanical Engineering and 12 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (15 papers) and Copper Interconnects and Reliability (12 papers). Kyung Wook Paik is often cited by papers focused on Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (15 papers) and Copper Interconnects and Reliability (12 papers) and collaborates with scholars based in South Korea, United States and Switzerland. Kyung Wook Paik's co-authors include Myung Jin Yim, Arthur L. Ruoff, Chang Kyu Kim, Ki Hwan Kim and Jae-Woong Nah and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of Materials Science