A.C.K. So
About
A.C.K. So has authored 6 papers that have received a total of 259 indexed citations.
This includes 5 papers in Mechanical Engineering, 4 papers in Electrical and Electronic Engineering and 2 papers in Computational Mechanics. The topics of these papers are Electronic Packaging and Soldering Technologies (4 papers), Intermetallics and Advanced Alloy Properties (3 papers) and 3D IC and TSV technologies (2 papers). A.C.K. So is often cited by papers focused on Electronic Packaging and Soldering Technologies (4 papers), Intermetallics and Advanced Alloy Properties (3 papers) and 3D IC and TSV technologies (2 papers) and collaborates with scholars based in Hong Kong. A.C.K. So's co-authors include J.K.L. Lai, Y.C. Chan, Y.C. Chan, P.L. Tu and Xing Dai and has published in prestigious journals such as Materials Science and Engineering B, Optics and Lasers in Engineering and IEEE Transactions on Components Packaging and Manufacturing Technology Part B
In The Last Decade
Explore authors with similar magnitude of impact
Top authors papers by Amanda Caine are co-authored with Top journals papers by Larry W. Easterling are published in Top authors papers by G. Schmiedel are co-authored with Top fields papers by Joshua Meyers are about Top fields papers by W.P. Groenendijk are about Top countries impacted by papers by Christian J. Niedworok Top authors papers by Jinfeng Shen are co-authored with Top fields papers by Joel Dworkin are about