A.C.K. So
About
A.C.K. So has authored 6 papers that have received a total of 259 indexed citations.
This includes 5 papers in Mechanical Engineering, 4 papers in Electrical and Electronic Engineering and 2 papers in Computational Mechanics. The topics of these papers are Electronic Packaging and Soldering Technologies (4 papers), Intermetallics and Advanced Alloy Properties (3 papers) and 3D IC and TSV technologies (2 papers). A.C.K. So is often cited by papers focused on Electronic Packaging and Soldering Technologies (4 papers), Intermetallics and Advanced Alloy Properties (3 papers) and 3D IC and TSV technologies (2 papers) and collaborates with scholars based in Hong Kong. A.C.K. So's co-authors include J.K.L. Lai, Y.C. Chan, Y.C. Chan, P.L. Tu and Xing Dai and has published in prestigious journals such as Materials Science and Engineering B, Optics and Lasers in Engineering and IEEE Transactions on Components Packaging and Manufacturing Technology Part B
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