Ahmer Syed
About
Ahmer Syed has authored 9 papers that have received a total of 103 indexed citations.
This includes 9 papers in Electrical and Electronic Engineering, 2 papers in Mechanical Engineering and 1 paper in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (7 papers) and Electromagnetic Compatibility and Noise Suppression (2 papers). Ahmer Syed is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (7 papers) and Electromagnetic Compatibility and Noise Suppression (2 papers) and collaborates with scholars based in United States, United Kingdom and Singapore. Ahmer Syed's co-authors include Robert Darveaux, Iver E. Anderson, Frank W. Gayle, John Mather and Tsung‐Yu Pan and has published in prestigious journals such as JOM, Microelectronics Reliability and Journal of Electronic Packaging
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