Journal of Electronic Packaging
About
The 2.0k papers published in Journal of Electronic Packaging in the last decades have received a total of 27.3k indexed citations.
Papers published in Journal of Electronic Packaging usually cover Electrical and Electronic Engineering (1.2k papers), Mechanical Engineering (1.0k papers) and Mechanics of Materials (514 papers) specifically the topics of Electronic Packaging and Soldering Technologies (886 papers), Heat Transfer and Optimization (493 papers) and 3D IC and TSV technologies (436 papers). The most active scholars publishing in Journal of Electronic Packaging are Yogendra Joshi, Issam Mudawar, John H. Lau, Abhijit Dasgupta and Cemal Basaran.
In The Last Decade
Fields of papers published in Journal of Electronic Packaging
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries where authors publish in Journal of Electronic Packaging
Since SpecializationTotal citations of papers
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