Albert T. Wu

77 papers and 1.1k indexed citations i.

Albert T. Wu has authored 77 papers that have received a total of 1.1k indexed citations. This includes 67 papers in Electrical and Electronic Engineering, 28 papers in Mechanical Engineering and 26 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (52 papers), 3D IC and TSV technologies (31 papers) and Copper Interconnects and Reliability (18 papers). Albert T. Wu is often cited by papers focused on Electronic Packaging and Soldering Technologies (52 papers), 3D IC and TSV technologies (31 papers) and Copper Interconnects and Reliability (18 papers) and collaborates with scholars based in Taiwan, United States and Italy. Albert T. Wu's co-authors include Hsin‐Yi Lee, Kwang‐Lung Lin, Ching‐Shun Ku and Chun‐Hsien Wang and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Acta Materialia