Kwang‐Lung Lin
About
Kwang‐Lung Lin has authored 198 papers that have received a total of 3.1k indexed citations.
This includes 174 papers in Electrical and Electronic Engineering, 105 papers in Mechanical Engineering and 33 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (143 papers), 3D IC and TSV technologies (80 papers) and Intermetallics and Advanced Alloy Properties (45 papers). Kwang‐Lung Lin is often cited by papers focused on Electronic Packaging and Soldering Technologies (143 papers), 3D IC and TSV technologies (80 papers) and Intermetallics and Advanced Alloy Properties (45 papers) and collaborates with scholars based in Taiwan, United States and India. Kwang‐Lung Lin's co-authors include Chien-Lung Liang, Udit Surya Mohanty, Albert T. Wu, Yi‐Shao Lai and Yu‐Wei Lin and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society
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