Chien-Lung Liang
About
Chien-Lung Liang has authored 22 papers that have received a total of 286 indexed citations.
This includes 22 papers in Electrical and Electronic Engineering, 9 papers in Mechanical Engineering and 9 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (12 papers) and Copper Interconnects and Reliability (9 papers). Chien-Lung Liang is often cited by papers focused on Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (12 papers) and Copper Interconnects and Reliability (9 papers) and collaborates with scholars based in Taiwan. Chien-Lung Liang's co-authors include Kwang‐Lung Lin, Po-Jen Cheng, Yung‐Sheng Lin, David Tarng and Chin-Li Kao and has published in prestigious journals such as Acta Materialia, Materials Science and Engineering A and Journal of Materials Science
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