Chin-Li Kao

21 papers and 281 indexed citations i.

Chin-Li Kao has authored 21 papers that have received a total of 281 indexed citations. This includes 21 papers in Electrical and Electronic Engineering, 5 papers in Electronic, Optical and Magnetic Materials and 3 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (18 papers) and Copper Interconnects and Reliability (5 papers). Chin-Li Kao is often cited by papers focused on Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (18 papers) and Copper Interconnects and Reliability (5 papers) and collaborates with scholars based in Taiwan, United States and Italy. Chin-Li Kao's co-authors include Yi‐Shao Lai, C. R. Kao, Yi-Shao Lai, David Tarng and Yung‐Sheng Lin and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Electrochimica Acta