David Tarng

23 papers and 113 indexed citations i.

David Tarng has authored 23 papers that have received a total of 113 indexed citations. This includes 22 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 4 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (17 papers) and Copper Interconnects and Reliability (4 papers). David Tarng is often cited by papers focused on Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (17 papers) and Copper Interconnects and Reliability (4 papers) and collaborates with scholars based in Taiwan and Japan. David Tarng's co-authors include Meng-Kai Shih, Chien-Lung Liang, Yung‐Sheng Lin, C.-P Hung and Kwang‐Lung Lin and has published in prestigious journals such as Scripta Materialia, Materials Chemistry and Physics and Nanomaterials