Meng-Kai Shih

29 papers and 139 indexed citations i.

Meng-Kai Shih has authored 29 papers that have received a total of 139 indexed citations. This includes 28 papers in Electrical and Electronic Engineering, 9 papers in Biomedical Engineering and 7 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (17 papers) and Integrated Circuits and Semiconductor Failure Analysis (8 papers). Meng-Kai Shih is often cited by papers focused on Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (17 papers) and Integrated Circuits and Semiconductor Failure Analysis (8 papers) and collaborates with scholars based in Taiwan. Meng-Kai Shih's co-authors include David Tarng, C.-P Hung, Dao-Long Chen, Karen Chen and De‐Shin Liu and has published in prestigious journals such as IEEE Transactions on Electron Devices, Materials and Journal of Electronic Materials