Dao-Long Chen
About
Dao-Long Chen has authored 30 papers that have received a total of 242 indexed citations.
This includes 15 papers in Electrical and Electronic Engineering, 12 papers in Mechanics of Materials and 8 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (10 papers) and Metal and Thin Film Mechanics (5 papers). Dao-Long Chen is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (10 papers) and Metal and Thin Film Mechanics (5 papers) and collaborates with scholars based in Taiwan, New Zealand and Singapore. Dao-Long Chen's co-authors include Meng-Kai Shih, Wei‐Hong Lai, Sheng‐Rui Jian, Yi-Shao Lai and David Tarng and has published in prestigious journals such as Journal of Applied Physics, Journal of Alloys and Compounds and Nanotechnology
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