Andy Fan

34 papers and 1.2k indexed citations i.

Andy Fan has authored 34 papers that have received a total of 1.2k indexed citations. This includes 16 papers in Electrical and Electronic Engineering, 13 papers in Biomedical Engineering and 11 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are 3D IC and TSV technologies (16 papers), Electronic Packaging and Soldering Technologies (15 papers) and Copper Interconnects and Reliability (11 papers). Andy Fan is often cited by papers focused on 3D IC and TSV technologies (16 papers), Electronic Packaging and Soldering Technologies (15 papers) and Copper Interconnects and Reliability (11 papers) and collaborates with scholars based in United States, France and South Sudan. Andy Fan's co-authors include R. Reif, Kuan‐Neng Chen, Chuan Seng Tan, Catherine M. Klapperich and James E. Galagan and has published in prestigious journals such as Nature Communications, Applied Physics Letters and PLoS ONE