Kuan‐Neng Chen

148 papers and 2.6k indexed citations i.

Kuan‐Neng Chen has authored 148 papers that have received a total of 2.6k indexed citations. This includes 141 papers in Electrical and Electronic Engineering, 31 papers in Electronic, Optical and Magnetic Materials and 27 papers in Biomedical Engineering. The topics of these papers are 3D IC and TSV technologies (109 papers), Electronic Packaging and Soldering Technologies (94 papers) and Copper Interconnects and Reliability (28 papers). Kuan‐Neng Chen is often cited by papers focused on 3D IC and TSV technologies (109 papers), Electronic Packaging and Soldering Technologies (94 papers) and Copper Interconnects and Reliability (28 papers) and collaborates with scholars based in Taiwan, United States and Singapore. Kuan‐Neng Chen's co-authors include R. Reif, Andy Fan, Chuan Seng Tan, Han‐Wen Hu and Cheng-Ta Ko and has published in prestigious journals such as Applied Physics Letters, Scientific Reports and Optics Letters