Cheng-Ta Ko

31 papers and 211 indexed citations i.

Cheng-Ta Ko has authored 31 papers that have received a total of 211 indexed citations. This includes 31 papers in Electrical and Electronic Engineering, 7 papers in Automotive Engineering and 5 papers in Biomedical Engineering. The topics of these papers are 3D IC and TSV technologies (26 papers), Electronic Packaging and Soldering Technologies (24 papers) and Additive Manufacturing and 3D Printing Technologies (7 papers). Cheng-Ta Ko is often cited by papers focused on 3D IC and TSV technologies (26 papers), Electronic Packaging and Soldering Technologies (24 papers) and Additive Manufacturing and 3D Printing Technologies (7 papers) and collaborates with scholars based in Taiwan, United States and China. Cheng-Ta Ko's co-authors include Kuan‐Neng Chen, Kai-Ming Yang, John H. Lau, Wei‐Chung Lo and Yuhua Chen and has published in prestigious journals such as Materials, IEEE Electron Device Letters and IEEE Transactions on Device and Materials Reliability