Han‐Wen Hu
About
Han‐Wen Hu has authored 51 papers that have received a total of 683 indexed citations.
This includes 29 papers in Electrical and Electronic Engineering, 13 papers in Biomedical Engineering and 9 papers in Materials Chemistry. The topics of these papers are 3D IC and TSV technologies (18 papers), Electronic Packaging and Soldering Technologies (16 papers) and Additive Manufacturing and 3D Printing Technologies (7 papers). Han‐Wen Hu is often cited by papers focused on 3D IC and TSV technologies (18 papers), Electronic Packaging and Soldering Technologies (16 papers) and Additive Manufacturing and 3D Printing Technologies (7 papers) and collaborates with scholars based in Taiwan, China and United States. Han‐Wen Hu's co-authors include Kuan‐Neng Chen, Yang‐Fang Chen, Yu‐Ming Liao, Hung‐I Lin and Golam Haider and has published in prestigious journals such as Angewandte Chemie International Edition, Advanced Materials and Nature Communications
In The Last Decade
Explore authors with similar magnitude of impact
Top fields papers by A. M. Hermann are about Top fields papers by Alexander Yong are about Top authors papers by Sergio R. Peraza‐Sánchez are co-authored with Top fields papers by Wildeman Zapata are about Top fields papers by Г. Е. Сулимова are about Top journals papers by В. А. Варнек are published in Top fields papers by Si Sun are about Top fields papers by Nicolas Boussion are about