Anil Kunwar
About
Anil Kunwar has authored 58 papers that have received a total of 645 indexed citations.
This includes 40 papers in Electrical and Electronic Engineering, 35 papers in Mechanical Engineering and 13 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (34 papers), 3D IC and TSV technologies (15 papers) and Intermetallics and Advanced Alloy Properties (14 papers). Anil Kunwar is often cited by papers focused on Electronic Packaging and Soldering Technologies (34 papers), 3D IC and TSV technologies (15 papers) and Intermetallics and Advanced Alloy Properties (14 papers) and collaborates with scholars based in China, Poland and Belgium. Anil Kunwar's co-authors include Haitao Ma, Yunpeng Wang, Ning Zhao, Haoran Ma and Mingliang Huang and has published in prestigious journals such as Acta Materialia, Scientific Reports and Applied Energy
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