Armin Klumpp
About
Armin Klumpp has authored 27 papers that have received a total of 355 indexed citations.
This includes 25 papers in Electrical and Electronic Engineering, 7 papers in Automotive Engineering and 5 papers in Biomedical Engineering. The topics of these papers are 3D IC and TSV technologies (12 papers), Electronic Packaging and Soldering Technologies (7 papers) and Additive Manufacturing and 3D Printing Technologies (7 papers). Armin Klumpp is often cited by papers focused on 3D IC and TSV technologies (12 papers), Electronic Packaging and Soldering Technologies (7 papers) and Additive Manufacturing and 3D Printing Technologies (7 papers) and collaborates with scholars based in Germany, Norway and Spain. Armin Klumpp's co-authors include Peter Ramm, Josef Weber, Robert Wieland, R. Merkel and Maaike M. Visser Taklo and has published in prestigious journals such as Applied Surface Science, Japanese Journal of Applied Physics and Sensors and Actuators A Physical
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