Robert Wieland
About
Robert Wieland has authored 18 papers that have received a total of 153 indexed citations.
This includes 10 papers in Electrical and Electronic Engineering, 3 papers in Mechanical Engineering and 3 papers in Automotive Engineering. The topics of these papers are 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (4 papers) and Additive Manufacturing and 3D Printing Technologies (3 papers). Robert Wieland is often cited by papers focused on 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (4 papers) and Additive Manufacturing and 3D Printing Technologies (3 papers) and collaborates with scholars based in Germany, United States and Switzerland. Robert Wieland's co-authors include Peter Ramm, Armin Klumpp, Josef Weber, R. Merkel and S. Altmannshofer and has published in prestigious journals such as Japanese Journal of Applied Physics, Applied Physics A and Applied Sciences
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