B. Michel

71 papers and 700 indexed citations i.

B. Michel has authored 71 papers that have received a total of 700 indexed citations. This includes 38 papers in Electrical and Electronic Engineering, 30 papers in Mechanics of Materials and 20 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (25 papers), Integrated Circuits and Semiconductor Failure Analysis (10 papers) and 3D IC and TSV technologies (9 papers). B. Michel is often cited by papers focused on Electronic Packaging and Soldering Technologies (25 papers), Integrated Circuits and Semiconductor Failure Analysis (10 papers) and 3D IC and TSV technologies (9 papers) and collaborates with scholars based in Germany, Spain and China. B. Michel's co-authors include D. Vogel, B. Wunderle, R. Dudek, Andreas Schubert and Olaf Wittler and has published in prestigious journals such as Applied Physics Letters, Nanotechnology and Engineering Fracture Mechanics