B. Salam

19 papers and 659 indexed citations i.

B. Salam has authored 19 papers that have received a total of 659 indexed citations. This includes 14 papers in Electrical and Electronic Engineering, 9 papers in Biomedical Engineering and 5 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (7 papers) and Advanced Sensor and Energy Harvesting Materials (5 papers). B. Salam is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (7 papers) and Advanced Sensor and Energy Harvesting Materials (5 papers) and collaborates with scholars based in Singapore, Taiwan and China. B. Salam's co-authors include R. Durairaj, Kwang‐Lung Lin, N.N. Ekere, Xuechuan Shan and Chengkuo Lee and has published in prestigious journals such as Nature Communications, ACS Nano and Synthetic Metals